Chang, Songyang; Lu, Linguo; Ullah, Irfan; Hou, Wentao; Gomez, Jose Fernando Florez; Conde-Delmoral, Amanda; Marin, Clara M Font; Morell, Gerardo; Chen, Zhongfang; Wu, Xianyong
Chang, Songyang; Lu, Linguo; Ullah, Irfan; Hou, Wentao; Gomez, Jose Fernando Florez; Conde-Delmoral, Amanda; Marin, Clara M Font; Morell, Gerardo; Che (2024). Copper Foil Substrate Enables Planar Indium Plating for Ultrahigh-Efficiency and Long-Lifespan Aqueous Trivalent Metal Batteries. Advanced Functional Materials, 34(44), -. DOI: 10.1002/adfm.202407342
Tipo de publicación:
Publicaciones en revistas
Referencia:
Chang, Songyang; Lu, Linguo; Ullah, Irfan; Hou, Wentao; Gomez, Jose Fernando Florez; Conde-Delmoral, Amanda; Marin, Clara M Font; Morell, Gerardo; Che (2024). Copper Foil Substrate Enables Planar Indium Plating for Ultrahigh-Efficiency and Long-Lifespan Aqueous Trivalent Metal Batteries. Advanced Functional Materials, 34(44), -. DOI: 10.1002/adfm.202407342
DOI / ISBN:
http://doi.org/10.1002/adfm.202407342
Departamento:
Año de publicación:
2024